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Cypress Semiconductor Electronic Components Datasheet

CY2304NZ Datasheet

Four Output PCI-X and General Purpose Buffer

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CY2304NZ
Four Output PCI-X and
General Purpose Buffer
Four Output PCI-X and General Purpose Buffer
Features
One input to four output buffer/driver
General-purpose or PCI-X clock buffer
Buffers all frequencies from DC to 140 MHz
Output-to-output skew less than 100 ps
Space-saving 8-pin TSSOP package
3.3 V operation
60 ps typical output-output skew
Functional Description
The CY2304NZ is a low-cost buffer designed to distribute
high-speed clocks for PCI-X and other applications. The device
operates at 3.3 V and outputs can run up to 140 MHz.
For a complete list of related documentation, click here.
Function Table
BUF_IN
L
H
L
H
Inputs
OE
L
L
H
H
Outputs
Output [1:4]
L
L
L
H
Block Diagram
OE
BUF_IN
Logic
Control
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
Pin Configuration
BUF_IN
OE
OUTPUT1
GND
8-pin TSSOP
Top View
18
27
36
45
OUTPUT4
OUTPUT3
VDD
OUTPUT2
Pin Description
For CY2304NZ
Signal
VDD
GND
BUF_IN
OUTPUT [1:4]
OE
Pin
6
4
1
3, 5, 7, 8
2
Description
3.3 V voltage supply
Ground
Input clock
Outputs
Input pin for output enable, active HIGH.
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 38-07099 Rev. *K
• San Jose, CA 95134-1709 • 408-943-2600
Revised May 4, 2016


Cypress Semiconductor Electronic Components Datasheet

CY2304NZ Datasheet

Four Output PCI-X and General Purpose Buffer

No Preview Available !

CY2304NZ
Maximum Ratings
Supply Voltage to Ground Potential .... –0.5 V to VDD + 0.5 V
DC Input Voltage ................................ –0.5 V to VDD + 0.5 V
Storage Temperature ............................... –65 °C to +150 °C
Max. Soldering Temperature (10 sec.) ...................... 260 °C
Junction Temperature ................................................ 150 °C
Operating Conditions
Parameter
Description
VDD
TA
CL
CIN
BUF_IN,
OUTPUT [1:4]
tPU [1]
Supply Voltage
Operating Temperature (Ambient Temperature)
Load Capacitance
Input Capacitance
Operating Frequency
Power-up time for all VDD’s to reach minimum specified voltage (power ramps must
be monotonic)
Min
3.0
–40
DC
0.05
Max Unit
3.6 V
85 °C
25 pF
7 pF
140 MHz
50 ms
Electrical Characteristics
Parameter
VIL
VIH
IIL
IIH
VOL
Description
Input LOW Voltage [2]
Input HIGH Voltage [2]
Input LOW Current
Input HIGH Current
Output LOW Voltage [3]
VOH
Output HIGH Voltage [3]
IDD Supply Current
Thermal Resistance
Parameter [4]
Description
θJA Thermal resistance
(junction to ambient)
θJC Thermal resistance
(junction to case)
Test Conditions
VIN = 0 V
VIN = VDD
IOL = 24 mA
IOL = 12 mA
IOH = –24 mA
IOH = –12 mA
Unloaded outputs at 66.66 MHz
Min Max Unit
– 0.8 V
2.0 – V
–5 5 A
–5 5 A
– 0.8 V
– 0.55 V
2.0 – V
2.4 – V
– 25 mA
Test Conditions
8-pin TSSOP
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
165
33
Unit
°C/W
°C/W
Notes
1. This operating condition guarantees skew and propagation delay.
2. BUF_IN input has a threshold voltage of VDD/2.
3. Parameter is guaranteed by design and characterization. It is not 100% tested in production.
4. These parameters are guaranteed by design and are not tested.
Document Number: 38-07099 Rev. *K
Page 2 of 8


Part Number CY2304NZ
Description Four Output PCI-X and General Purpose Buffer
Maker Cypress
Total Page 8 Pages
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