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WEDPNF8M721V-1212BI Datasheet Preview

WEDPNF8M721V-1212BI Datasheet

8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

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White Electronic Designs WEDPNF8M721V-XBX
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module
Multi-Chip Package ADVANCED*
FEATURES
n Sector Architecture
n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm
n Commercial, Industrial and Military Temperature Ranges
n Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical
• One 16KByte, two 8KBytes, one 32KByte, and fif
teen 64KBytes in byte mode
• One 8K word, two 4K words, one 16K word, and
fifteen 32K word sectors in word mode.
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
SDRAM PERFORMANCE FEATURES
n Organized as 8M x 72
n High Frequency = 100, 125MHz
n Single 3.3V ±0.3V power supply
n Fully Synchronous; all signals registered on positive
edge of system clock cycle
n Boot Code Sector Architecture (Bottom)
n Embedded Erase and Program Algorithms
n Erase Suspend/Resume
• Supports reading data from or programing data to a
sector not being erased
BENEFITS
n Internal pipelined operation; column address can be
changed every clock cycle
n Internal banks for hiding row access/precharge
n Programmable Burst length 1,2,4,8 or full page
n 4096 refresh cycles
FLASH PERFORMANCE FEATURES
n User Configurable as 1Mx8 or 512Kx16
n Access Times of 100, 120, 150ns
n 3.3 Volt for Read and Write Operations
n 1,000,000 Erase/Program Cycles
n 42% SPACE SAVINGS
n Reduced part count
n Reduced I/O count
• 14% I/O Reduction
n Suitable for hi-reliability applications
n SDRAM Upgradeable to 16M x 72 density (contact
factory for information)
n Flash upgradeable to 2M x 8 (or 1M x 16 or 512K x 32)
density
* This data sheet describes a product that may or may not be under
development and is subject to change or cancellation without notice.
September 2002 Rev. 3
1 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com




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WEDPNF8M721V-1212BI Datasheet Preview

WEDPNF8M721V-1212BI Datasheet

8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

No Preview Available !

White Electronic Designs WEDPNF8M721V-XBX
FIG. 1 PIN CONFIGURATION
TOP VIEW
NOTES:
1. DNU = Do Not Use
2. FD16-31, BYTE2, RY/BY2 are NC in this part, and used for flash upgraded to WEDPN8M722V-XBX (2x8M Flash).
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
2


Part Number WEDPNF8M721V-1212BI
Description 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
Maker ETC
Total Page 30 Pages
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