* 4 A, 60 V. RDS(ON) = 80 mΩ @ VGS = 5 V
* Occupies only 5 mm2 of PCB area: only 55% of the area of SSOT-6
* Ultra-thin package: less than 0.80 mm height whe.

* Solenoid Drivers D S D S S D D S S D D Index slot Index slot G D G Bottom Top TA=25oC unless otherwise no.

Combining Fairchild’s advanced PowerTrench process with state-of-the-art BGA packaging, the FDZ209N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent th.

FDZ201N

FDZ202P

FDZ203N

FDZ2040L

FDZ204P

FDZ206P

FDZ208P

FDZ2551N

FDZ2552P

FDZ2553N

FDZ2554P

FDZ291P

FDZ293P