z Silicon Chip on Direct-Copper Bond (DCB) Substrate z miniBLOC, with Aluminium Nitride Isolation z Optimized for Low Switching Losses z Isolated Mounting Surface z Anti-.

z Power Inverters z UPS z Motor Drives z SMPS z PFC Circuits z Battery Chargers z Welding Machines z Lamp Ballasts © 20.

Extreme Light Punch Through IGBT

IXXN200N60B3

IXXN200N60B3H1

IXXN200N65A4

IXXN100N60B3H1

IXXN340N65B4

IXXA30N65C3HV

IXXA50N60B3

IXXH100N60B3

IXXH100N60C3

IXXH110N65B4

IXXH110N65C4

IXXH140N65B4

IXXH140N65C4

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