• Low Input Capacitance: 6.0pF Typical
• Low Gate Leakage: 10pA Typical
• High Breakdown Voltage: -60V Typical
• Small Die: 416um X 416um X 203um
• Bond Pads: 90um X 90um
• Substrate Connected to Gate
• Au Back-Side Finish
Applications
• General Purpose Amplifier
• Small Signal Amplifier
• Custom Pa.