= -40°C VDS, Drain-to-Source Voltage (V) V DS, Drain-to-Source Voltage (V) Fig 5. Typical Output Characteristics 2.0 ID = 32A Typical RDS(on) (Normalized) ID, Drain-t.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6726MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET pack.

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