IRFBC30S mosfet equivalent, power mosfet.
because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. T.
Third generation HEXFETs from international Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2Pak is a surface mount power package capable ofthe accom.
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