• Part: GTRB204402FC
  • Description: Thermally-Enhanced High Power RF GaN on SiC HEMT
  • Manufacturer: MACOM Technology Solutions
  • Size: 904.05 KB
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MACOM Technology Solutions
GTRB204402FC
GTRB204402FC is Thermally-Enhanced High Power RF GaN on SiC HEMT manufactured by MACOM Technology Solutions.
Description The GTRB204402FC/1 is a 350-watt (P3d B) Ga N on Si C high electron mobility transistor (HEMT) designed for use in multi-standard cellular power amplifier applications. It features high efficiency, and a thermally-enhanced package with earless flange. Package Types: H-37248C-4 Peak/Average Ratio, Gain (d B) Efficiency (%) Single-carrier WCDMA Drive-up VDD = 48 V, IDQ(Main) = 150 m A, VGS(Peak) = -5.5 V, ƒ = 2020 MHz, 3GPP WCDMA signal, PAR = 10 d B, 3.84 MHz BW 40 35 30 25 20 15 10 5 0 Efficiency 20 Gain -20 -40 PAR @ 0.01% CCDF -60 GTRB204402FC_g1 -80 30 35 40 45 50 55 Average Output Power (d Bm) Features - Ga N on Si C HEMT technology - Typical Pulsed CW performance, 2020 MHz, 48 V, 10 µs pulse width, 10% duty cycle, bined outputs - Output power at P3d B = 350 W - Efficiency at P3d B = 65% - Human Body Model Class 1C (per ANSI/ESDA/JEDEC JS-001) - Pb-free and Ro HS pliant Typical RF Characteristics Single-carrier WCDMA Specifications (tested in the Doherty evaluation board for 1930 to 2020 MHz) VDD = 48 V, IDQ = 150 m A, VGS(PEAK) = - 5.5 V, channel bandwidth = 3.84 MHz, peak/average = 10 d B @ 0.01% CCDF 1930 MHz 1975 MHz 2020 MHz POUT (d BM) Gain (d...