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K4B1G0446E - 1Gb E-die DDR3 SDRAM

Description

11 5.

DDR3 SDRAM Addressing 12 6.

Absolute Maximum Ratings 13 6.1 Absolute Maximum DC Ratings 13 6.2 DRAM Component Operating Temperature Range 13 7.

Features

  • 5 3. Package pinout/Mechanical Dimension & Addressing 6 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package 6 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package 7 3.3 x16 Package Pinout (Top view) : 96ball FBGA Package 8 3.4 FBGA Package Dimension (x4/x8) 9 3.5 FBGA Package Dimension (x16) 10 4. Input/Output Functional.

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Other Datasheets by Samsung Semiconductor

Part Number Description
K4B1G0446F 1Gb F-die DDR3 SDRAM
K4B1G0446G 1Gb G-die DDR3 SDRAM
K4B1G0446G-BCF8 1Gb G-die DDR3 SDRAM
K4B1G0446G-BCH9 1Gb G-die DDR3 SDRAM
K4B1G0446G-BCK0 1Gb G-die DDR3 SDRAM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Rev. 1.4, Nov. 2009 K4B1G0446E K4B1G0846E K4B1G1646E 1Gb E-die DDR3 SDRAM 60FBGA & 84FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
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