THGBMBG5D1KBAIL Datasheet 4GB density e-MMC

Manufacturer: Toshiba

Overview: THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use.

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THGBMBG5D1KBAIL 4gb density e-mmc by Toshiba - Datasheet Preview

Datasheet Details

Part number	THGBMBG5D1KBAIL
Manufacturer	Toshiba
File Size	1.02 MB
Description	4GB density e-MMC
Download	THGBMBG5D1KBAIL Download (PDF)

Key Features

THGBMBG5D1KBAIL Interface THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC VSF VSF RFU Vss Vcc RFU NC NC RFU 9 NC NC NC VSF Vcc NC NC NC 8 NC NC NC RFU Vss NC NC NC Top View 7 RFU NC NC Vss RFU.

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