THGBMHG7C1LBAIL Description
THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG7C1LBAIL has an industry standard MMC protocol for easy use.