CP312 Datasheet (Central Semiconductor) - Power Transistor NPN

CP312, Power Transistor NPN - Amp/Switch Transistor Chip

PROCESS Power Transistor CP312 NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 2,230 PRINCIPAL DEVICE TYPES CZT3120 EPITAXIAL PLANAR 70 x 70 MILS 9.0 MILS 11.4 x 18.1 MILS 13.8 x 23.6 MILS Al - 30,000Å Ti/Ni/Ag - 11,300Å R4 (22-March 2010) w w w.

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c o m www.DataSheet4U.com PROCESS CP312 Typical Electrical C