CP314 Datasheet (Central Semiconductor) - Small Signal Transistor NPN

CP314, Small Signal Transistor NPN - High Current Transistor Chip

Central TM PROCESS CP314 Semiconductor Corp.

Small Signal Transistor NPN - High Current Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 6,936 PRINCIPAL DEVICE TYPES CBCP68 CBCX68 CZT651 MPS650 MPS651 EPITAXIAL PLANAR 40 x 40 MILS 9.0 MILS 7.9 x 8.7 MILS 9.0 x 14 MILS Al - 30,000Å Au - 18,000Å BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788