CP316V Datasheet (Central Semiconductor) - Small Signal Transistors NPN

CP316V, Small Signal Transistors NPN - High Voltage Transistor Chip

PROCESS Small Signal Transistors CP316V NPN - High Voltage Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 57,735 PRINCIPAL DEVICE TYPES CMPT5551 CXT5551 CZT5551 2N5551 EPITAXIAL PLANAR 20 x 20 MILS 7.1 MILS 4.0 x 4.0 MILS 4.7 x 4.7 MILS Al - 30,000Å Au - 18,000Å R2 (22-March 2010) w w w.

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