CY7C344 Description
Available in a 28-pin, 300-mil DIP or windowed J-leaded ceramic chip carrier (HLCC), the CY7C344 represents the densest EPLD of this size. Numbers in () refer to J-leaded packages.
CY7C344 Key Features
- High-performance, high-density replacement for TTL, 74HC, and custom logic
- 32 macrocells, 64 expander product terms in one LAB
- 8 dedicated inputs, 16 I/O pins
- 0.8-micron double-metal CMOS EPROM technology