Part number:
GP200MHS18
Manufacturer:
Dynex Semiconductor
File Size:
135.70 KB
Description:
Half bridge igbt module.
GP200MHS18_DynexSemiconductor.pdf
Datasheet Details
GP200MHS18 Features
* s s s s Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 200A Per Arm KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 200A 400A APPLICATIONS s s s s High Power Inverters Motor Controllers Induction Heating Resonant Converters 11(C2) 1
GP200MHS18_DynexSemiconductor.pdf
Datasheet Details
GP200MHS18
Dynex Semiconductor
135.70 KB
Half bridge igbt module.
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