GP200MHS18 Datasheet, Module, Dynex Semiconductor

GP200MHS18 Features

Module s s s s Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 200A Per Arm KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 3.5V 200A

PDF File Details

Part number:

GP200MHS18

Manufacturer:

Dynex Semiconductor

File Size:

135.70kb

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📄 Datasheet

Description:

Half bridge igbt module.

📥 Download PDF (135.70kb)

GP200MHS18 Application

Applications s s s s High Power Inverters Motor Controllers Induction Heating Resonant Converters 11(C2) 1(E1C2) 2(E2) 6(G2) 7(E2) 3(C1) 5(E1) 4(

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