Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ293P minimizes both PCB space and rDS(on).
Features
- 4.6 A,.
- 20 V rDS(on) = 46 mΩ @ VGS =.
- 4.5 V rDS(on) = 72 mΩ @ VGS =.
- 2.5 V.
- Occupies only 2.25 mm2 of PCB area. Less than 50% of the area of a SSOT-6.
- Ultra-thin package: less than 0.85 mm height when mounted to PCB.
- Outstanding thermal transfer characteristics: 4 times better than SSOT-6.
- Ultra-low Qg x rDS(on) figure-of-merit.
- High power and current handling capability. S.
FDZ293P_FairchildSemiconductor.pdf
