Description
www.DataSheet4U.com Freescale Semiconductor Technical Data MPX2300DT1 Rev.6, 10/2004 High Volume Pressure Sensor For Disposable Applications Frees.
Chip Pak, Full Gel Chip Pak, 1/3 Gel Tape Width 24 mm Marking Date Code, Lot ID Date Code, Lot ID Quantity 1000 pc/reel
PACKAGE DIMENSIONS
A M C L N.
Features
* Low Cost
* Integrated Temperature Compensation and Calibration
* Ratiometric to Supply Voltage
* Polysulfone Case Material (Medical, Class V Approved)
* Provided in Easy
* to
Applications
* Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub
* module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. T
