MPX2300D Datasheet (Motorola)

MPX2300D, PRESSURE SENSORS

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub module component or a disposable unit.

The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.

This new chip carrier package uses Motorola’s unique sensor die with its patented, piezoresis

MPX2300D Features

* Low Cost

* Patented piezoresistive strain gauge implant, temperature compensation and calibration all integrated on a single, monolithic sensor die.

* Pressure Range Available: 0

* 300 mmHg

* Polysulfone (Mindell S

* 1000) Case Material (Medical, Class