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H55S2622JFR-A3M, H55S2622JFR-60M Datasheet - Hynix Semiconductor

H55S2622JFR-A3M, H55S2622JFR-60M, 256MBit MOBILE SDR SDRAMs based on 2M x 4Bank x32 I/O

www.DataSheet4U.com 256MBit MOBILE SDR SDRAMs based on 2M x 4Bank x32 I/O Specification of 256M (8Mx32bit) Mobile SDRAM Memory Cell Array - Organiz.
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H55S2622JFR-60M_HynixSemiconductor.pdf

This datasheet PDF includes multiple part numbers: H55S2622JFR-A3M, H55S2622JFR-60M. Please refer to the document for exact specifications by model.

Datasheet Details

Part number:

H55S2622JFR-A3M, H55S2622JFR-60M

Manufacturer:

Hynix Semiconductor

File Size:

1.25 MB

Description:

256MBit MOBILE SDR SDRAMs based on 2M x 4Bank x32 I/O

Note:

This datasheet PDF includes multiple part numbers: H55S2622JFR-A3M, H55S2622JFR-60M.
Please refer to the document for exact specifications by model.

Features

* Standard SDRAM Protocol Clock Synchronization Operation - All the commands registered on positive edge of basic input clock (CLK)
* MULTIBANK OPERATION - Internal 4bank operation - During burst Read or Write operation, burst Read or Write for a different bank is performed. - Duri

Applications

* which requires large memory density and high bandwidth. It is organized as 4banks of 2,097,152 x32. Mobile SDRAM is a type of DRAM which operates in synchronization with input clock. The Hynix Mobile SDRAM latch each control signal at the rising edge of a basic input clock (CLK) and input/output dat

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