* l Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Weight 4 g l l l Moderate frequency IGBT and antiparallel FRED in one package New generation HDMOSTM process International standard package JEDEC TO-220AB and TO-263AA High peak current handling capability Symbol T
IXGP12N60B Datasheet (98.91 KB)
IXGP12N60B
IXYS Corporation
98.91 KB
Hiperfast igbt.
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HiPerFASTTM IGBT
IXGA 12N60B IXGP 12N60B
VCES IC25 VCE(sat) tfi(typ)
= 600 V = 24 A = 2.1 V = 120 ns
Preliminary data sheet
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