* MAL RESISTANCE Symbol Rth(j-c)Q Rth(j-c)Di Rth(c-f) Parameter Junction to case Thermal Resistance Contact Thermal Resistance IGBT FWDi Case to fin, (per 1 module) Thermal grease applied Test Conditions Limits Min.
* Typ.
* Max. 0.94 1.15 0.09 U
PM52AUBW060 Datasheet (88.38 KB)
PM52AUBW060
Mitsubishi Electric
88.38 KB
Intelligent power module.
PM52AUBW060
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MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR
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