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MMBT3906LT1 - General Purpose Transistor

MMBT3906LT1 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBT3906LT1/D General Purpose Transistor PNP Silicon 1 BASE COLLECTOR 3 MMBT3906LT1 .

MMBT3906LT1 Features

* shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less.
* After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temper

MMBT3906LT1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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Datasheet Details

Part number
MMBT3906LT1
Manufacturer
Motorola
File Size
221.88 KB
Datasheet
MMBT3906LT1_MotorolaInc.pdf
Description
General Purpose Transistor

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General Purpose Transistor Motorola
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