NCSA170BT - LED
Ceramics +() Hard Glass and Silicone Resin(with phosphor) Encapsulating Resin Materials Electrodes Materials Weight Silicone Resin Au-plated 0.0058g(TYP) * 。 Dimensions do not include mold flash.
1.6 KA Protection Device 4 SOLDERING * Reflow Soldering Condition(Lead-free S
NICHIA STS-DA1-2950B