TSSOP48 Datasheet - Philips

TSSOP48 PC board footprint

Philips Semiconductors PC board footprint Footprint information for reflow soldering of TSSOP48 package SOT362-1 Hx Gx P2 (0.125) (0.125) Hy Gy By Ay C D2 (4x) P1 Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 0.560 Ay 8.900 By 6.100 C 1.400 D1 0.280 D2 Gx Gy Hx Hy 0.400 12.270 7.000 14.100 9.150 SOT362-1_fp © Koninklijke Philips Electronics N.V. 2004. All rights reserved. PDF 8 Octo.

TSSOP48-Philips.pdf

TSSOP48 Datasheet Preview — Preview of TSSOP48 PDF

Datasheet Details

Part number:

TSSOP48

Manufacturer:

Philips

File Size:

84.44 KB

Description:

Pc board footprint.

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