TSSOP48 - PC board footprint
Philips Semiconductors PC board footprint Footprint information for reflow soldering of TSSOP48 package SOT362-1 Hx Gx P2 (0.125) (0.125) Hy Gy By Ay C D2 (4x) P1 Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 0.560 Ay 8.900 By 6.100 C 1.400 D1 0.280 D2 Gx Gy Hx Hy 0.400 12.270 7.000 14.100 9.150 SOT362-1_fp © Koninklijke Philips Electronics N.V.
2004.
All rights reserved.
PDF 8 Octo
