TSSOP14
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14-lead thin shrink small outline.
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📁 Related Datasheet
TSSOP - Small Outline Packages
(STATS ChipPAC)
TSSOP and MSOP
Small Outline Packages
• Wide range of body sizes • 8 to 56 lead counts • Thermally enhanced versions available (TSSOP-ep and MSOP-ep)
.
TSSOP-16 - 16-Pin Ceramic Case
(RFM)
TSSOP-16 Package
16-Pin Ceramic Case 6.4 X 5.0 mm Nominal Footprint
Case Dimensions
Dimension A B C D E F G L L1 R R1 01 02 03 mm Nom Max 4.40 4.50 5..
TSSOP-16 - 16 Lead TSSOP Package Dimensions
(Fairchild Semiconductor)
16 Lead TSSOP Package Dimensions
TSSOP-16
7.72 TYP 4.16 TYP. (1.78 TYP) 5.0 ± 0.1 -A0.42 TYP
8
16
0.65 TYP LAND PATTERN RECOMMENDATION
6.4
GAGE .
TSSOP-20 - Mechanical Dimensions
(ETC)
Packaging Information Mechanical Dimensions TSSOP-20
6.400(0.252) 6.600(0.260)
Unit: mm(inch)
1.450(0.057) 0.000(0.000) Dp 1.550(0.061) 0.100(0.004).
TSSOP-8 - Tape and Reel Dimensions
(Alpha & Omega Semiconductors)
TSSOP-8 Tape and Reel Dimensions
Carrier Tape
D1 T P1 P2 E1 E2 B0 E
K0 Unit: mm Package TSSOP-8 (12mm) A0 6.80 ±0.10 B0 3.40 ±0.10 K0 1.60 ±0.10 D0 1.
TSSOP-B14J - IC Packages
(Rohm)
Design Support Document
IC Packages
TSSOP-B14J
5.0±0.1 (Max 5.35 include BURR)
14 8
4º ±4º
6.4±0.2 4.4±0.1
0.55 1.0±0.05
1
7
1PIN MARK S
+0.0.
TSSOP-B8 - LSI Assembly
(Rohm)
LSI Assembly
TSSOP-B8/B8J
(Units : mm)
• TSSOP-B8/B8J
3.0
8 5
3.0
8 5
6.4 4.4
4.9 3.0
1 4 1 4
H=1.2Max.
H=1.1Max.
The contents described here.
TSSOP-B8J - LSI Assembly
(Rohm)
LSI Assembly
TSSOP-B8/B8J
(Units : mm)
• TSSOP-B8/B8J
3.0
8 5
3.0
8 5
6.4 4.4
4.9 3.0
1 4 1 4
H=1.2Max.
H=1.1Max.
The contents described here.
TSSOP-C10J - LSI Assembly
(Rohm)
LSI Assembly
TSSOP-C10J
• TSSOP-C10J
3.0±0.1 (Max 3.35 include BURR)
10 9 8 7 6
4 +6 -4
4.9±0.2
3.0±0.1
0.45±0.15 0.85±0.05 0.5
1 2 3 4 5
1PIN .
TSSOP-C48V - LSI Assembly
(Rohm)
LSI Assembly
TSSOP-C48V
• TSSOP-C48V
12.5±0.1 (MAX 12.85 include BURR)
48 25
4¼ +6¼ -4¼
8.1±0.2 6.1±0.1
0.5 1.0MAX
1
1PIN MARK
24
S
0.85±0.0.
