Datasheet Specifications
- Part number
- K4R271669F
- Manufacturer
- Samsung semiconductor
- File Size
- 292.12 KB
- Datasheet
- K4R271669F_Samsungsemiconductor.pdf
- Description
- 128Mbit RDRAM(F-die)
Description
K4R271669F Direct RDRAM™ 128Mbit RDRAM(F-die) 256K x 16 bit x 32s Banks Direct RDRAMTM Version 1.41 January 2004 Page -1 Version 1.41 Jan.2004 .
Features
* for mobile, graphics and communications include power management and byte masking. Direct RDRAM™ SEC 240 xCS8 K4R271669F Figure 1: Direct RDRAM CSP Package The 128Mbit RDRAM devices are offered in a horizontal center-bond fanout CSP package. Key Timing Parameters/Part Numbers Speed OrganizationApplications
* including communications, graphics, video and any other application where high bandwidth and low latency are required. The 128Mbit RDRAM devices are extremely high-speed CMOS DRAMs organized as 8M words by 16. The use of Rambus Signaling Level (RSL) technology permits 800MHz transfer rates while usiK4R271669F Distributors
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