Part number:
K4S280832F-TC75
Manufacturer:
Samsung semiconductor
File Size:
145.68 KB
Description:
128mb f-die sdram specification.
K4S280832F-TC75_Samsungsemiconductor.pdf
Datasheet Details
Part number:
K4S280832F-TC75
Manufacturer:
Samsung semiconductor
File Size:
145.68 KB
Description:
128mb f-die sdram specification.
K4S280832F-TC75, 128Mb F-die SDRAM Specification
The K4S280432F / K4S280832F / K4S281632F is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x 8,388,608 words by 4 bits / 4 x 4,194,304 words by 8 bits / 4 x 2,097,152 words by 16 bits, fabricated with SAMSUNG′s high performance CMOS technology.
Synchronous design allows preci
SDRAM 128Mb F-die (x4, x8, x16) Preliminary CMOS SDRAM 128Mb F-die SDRAM Specification Revision 0.2 November.
2003 Samsung Electronics reserves the right to change products or specification without notice.
Rev.
0.2 November.
2003 SDRAM 128Mb F-die (x4, x8, x16) Revision History Revision 0.0 (Agust, 2003) - First release.
Revision 0.1 (November, 2003) - completed DC characteristics.
Revision 0.2 (November, 2003) - Preliminary spec release.
Preliminary CMOS SDRAM Rev.
0.2 November.
2
K4S280832F-TC75 Features
* JEDEC standard 3.3V power supply
* LVTTL compatible with multiplexed address
* Four banks operation
* MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave)
* All inputs are
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