TSS0340U Datasheet - Taiwan Semiconductor Company

TSS0340U Surface Mount Schottky Barrier

Multiple manufacture source Green compound Define manufacture source Green compound DIM. L W T C D Unit (mm) Min Typ. Max 1.60 - 1.80 0.80 - 1.00 0.70 - 0.45 0.85 - - 0.70 - Min 0.063 0.031 0.028 - Unit (inch) Typ. - 0.018 0.028 Max 0.071 0.039 0.033 - Document Number: DS_S1411007 Versi.

TSS0340U Features

* - Designed for mounting on small surface - Extremely thin/leadless package - Low capacitance - Low forward voltage drop - Packing code with suffix "G" means green compound (halogen-free) TSS0340U Taiwan Semiconductor MECHANICAL DATA - Case: 0603 - Terminal: Gold plated, solderable per MIL-STD-750,

TSS0340U_TaiwanSemiconductorCompany.pdf