l A monolithic power IC with a new structure combining a control block and a vertical power MOS FET (π-MOS) on a single chip. l Can directly drive a power load from a CMOS logic. l Built-in protection against overvoltage, load short circuiting, and thermal shutdown. l Low on resistance : RDS (ON) = 0.5 Ω(max), (@VIN = 5 V, Tj = 25°C) l 3-pin power-molded package usable for surface mounting. Pin Assignment
Weight HSIP3-P-2.30B HSOP3-P-2.30A
: 0.36 g (typ. ) : 0.28 g (typ. )
Note:
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