Datasheet Details
Part number:
TGS2303
Manufacturer:
TriQuint Semiconductor
File Size:
340.72 KB
Description:
SP3T VPIN
TGS2303_TriQuintSemiconductor.pdf
Datasheet Details
Part number:
TGS2303
Manufacturer:
TriQuint Semiconductor
File Size:
340.72 KB
Description:
SP3T VPIN
Features
* and PerformanceApplications
* Curing should be done in a convection oven; proper exhaust is a safety concern. Microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical. Interconnect process assembly notes:TGS2303 Distributors
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