Datasheet Details
- Part number
- TGS2303
- Manufacturer
- TriQuint Semiconductor
- File Size
- 340.72 KB
- Datasheet
- TGS2303_TriQuintSemiconductor.pdf
- Description
- SP3T VPIN
TGS2303 Description
Product Data Sheet August 5, 2008 SP3T PIN Switch TGS2303 Key .
TGS2303 Features
* and Performance
* Vertical PIN Monolithic Process 0.2-18 GHz Frequency Range 0.5 dB Insertion Loss, Typical 35 dB Isolation, Typical 20 dB Typical Input and Output Return Loss Compatible with Fully Automated Assembly Series-Shunt-Shunt Configuration
C
TGS2303 Applications
* Curing should be done in a convection oven; proper exhaust is a safety concern. Microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical. Interconnect process assembly notes:
* Thermosonic ball bondi
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