Datasheet Details
- Part number
- TGS8250-SCC
- Manufacturer
- TriQuint Semiconductor
- File Size
- 542.17 KB
- Datasheet
- TGS8250-SCC_TriQuintSemiconductor.pdf
- Description
- SPDT FET Switch
TGS8250-SCC Description
Product Data Sheet SPDT FET Switch TGS8250-SCC Key .TGS8250-SCC Features
* and PerformanceTGS8250-SCC Applications
* Bond pad and backside metallization are gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression and thermosonic wire bonding processes. The TGS8250-SCC is supplied in chip form and is engineered for high-volume automated assembly. TriQuint Semiconducto📁 Related Datasheet
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