Datasheet Details
Part number:
WED3C755E8M-XBX
Manufacturer:
White Electronic Designs Corporation
File Size:
377.53 KB
Description:
RISC MICROPROCESSOR MULTI-CHIP PACKAGE
WED3C755E8M-XBX_WhiteElectronicDesignsCorporation.pdf
WED3C755E8M-XBX_WhiteElectronicDesignsCorporation.pdf
Datasheet Details
Part number:
WED3C755E8M-XBX
Manufacturer:
White Electronic Designs Corporation
File Size:
377.53 KB
Description:
RISC MICROPROCESSOR MULTI-CHIP PACKAGE
Features
* doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, configured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) MaApplications
* such as missiles, aerospace, flight computers, fire control systems and rugged critical systems. Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX Footprint compatible with Motorola MPC 745 This product is subject to change without notice. FIG. 1 - MULTI-CHIP PACKAGE DIAGRAM SSRAM µP 75WED3C755E8M-XBX Distributors
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