Part number:
WED3C755E8M-XBX
Manufacturer:
White Electronic Designs Corporation
File Size:
377.53 KB
Description:
Risc microprocessor multi-chip package.
WED3C755E8M-XBX_WhiteElectronicDesignsCorporation.pdf
Datasheet Details
WED3C755E8M-XBX Features
* doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, configured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) Ma
WED3C755E8M-XBX_WhiteElectronicDesignsCorporation.pdf
Datasheet Details
WED3C755E8M-XBX
White Electronic Designs Corporation
377.53 KB
Risc microprocessor multi-chip package.
WED3C755E8M-XBX Distributor
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