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WED3C755E8M-XBX Datasheet - White Electronic Designs Corporation

WED3C755E8M-XBX - RISC MICROPROCESSOR MULTI-CHIP PACKAGE

WED3C755E8M-XBX Features

* doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, configured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) Ma

WED3C755E8M-XBX_WhiteElectronicDesignsCorporation.pdf

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Datasheet Details

Part number:

WED3C755E8M-XBX

Manufacturer:

White Electronic Designs Corporation

File Size:

377.53 KB

Description:

Risc microprocessor multi-chip package.

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