WED3C755E8M-XBX - RISC MICROPROCESSOR MULTI-CHIP PACKAGE

Product Overview

White Electronic Designs Corporation

Part number	WED3C755E8M-XBX
Manufacturer	White Electronic Designs Corporation
File Size	377.53 KB
Description	RISC MICROPROCESSOR MULTI-CHIP PACKAGE
Datasheet	WED3C755E8M-XBX Datasheet
Additional preview pages of the WED3C755E8M-XBX datasheet.

doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, conﬁgured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) Maximum 60x Bus frequency = 66MHz.

📁 Similar Datasheet

WED3C7558M-XBX - RISC Microprocessor (White Electronic Designs)
WED3C7410E16M-400BX - RISC Microprocessor (White Electronic Designs)
WED3C7410E16M-XBHX - 7410E RISC Microprocessor (White Electronic Designs)
WED3DG644V-D1 - 32MB - 4Mx64 SDRAM (White Electronic Designs)
WED3DG6466V-AD1 - 512MB - 64Mx64 SDRAM UNBUFFERED (White Electronic Designs)
WED3DG6466V-D1 - 512MB -64Mx64 SDRAM UNBUFFERED (White Electronic Designs)
WED3DG6466V-D2 - SDRAM UNBUFFERED (White Electronic Designs)
WED3DG6466V-JD1 - 512MB -64Mx64 SDRAM UNBUFFERED (White Electronic Designs)

Other Datasheets by White Electronic Designs Corporation

Published: Mar 21, 2010 |