WED3C755E8M-XBX Datasheet, package equivalent, White Electronic Designs Corporation

WED3C755E8M-XBX Features

• Package doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, configured as 128Kx72

PDF File Details

Part number:

WED3C755E8M-XBX

Manufacturer:

White Electronic Designs Corporation

File Size:

377.53kb

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📄 Datasheet

Description:

Risc microprocessor multi-chip package.

WED3C755E8M-XBX Application

• Applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems. Footprint compatible with WED3C7558M-XBX

TAGS

WED3C755E8M-XBX

White Electronic Designs Corporation

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