Description
NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
Features
- High collector current capability IC and ICM.
- Reduced Printed-Circuit Board (PCB) area requirements.
- Exposed heat sink for excellent thermal and electrical conductivity.
- Two current gain selections.
- Leadless very small SMD plastic package with medium power capability.
- Suitable for Automatic Optical Inspection (AOI) of solder joint
3.
