XGZP6847
Overview
XGZP is a surface mounting pressure sensor based on CFSensor silicon based piezoresistive pressure sensor die(XGZP2009).The sensor die is bonded on a substrate with a plastic cap and packaged in a 6-pin small size and high reliability of on-chip integration make this sensor a simple and economical choice for high volume application in a variety of industries. With standard DIP6 package, XGZP is easy for users to install through hole board assembly.
- Ranges: -100～7kPaG…700kPaG(-15～1PSI…105PSIG)
- MEMS Technology,Solid-state reliability
- Low cost for high volume application
- Dual-In-Line(DIP 6 Pins)
- For non-corrosive gas or air
- Working temp.: -30℃～+100℃(-22℉～+212℉)
- Pressurize from back side of the chip
- Easy to use and embed in OEM equipment
