ChipSourceTek MX2301
The MX2301 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. It can be used in a wide variety of applications.| Part No. | MX2301 |
|---|---|
| Datasheet | MX2301 Download |
| Manufacturer |  ChipSourceTek |
| Description | P-Channel Power MOSFET |
| Buy | Stock & Price |
DESCRIPTION
It can be used in a wide variety of applications.GENERAL FEATURES
● VDS=-20V, ID=-3A RDS(ON)(Typ.)=110mΩ @ VGS=-2.5V RDS(ON)(Typ.)=85mΩ @ VGS=-4.5V● High Power and current handing capability
● Lead free product is acquired
● Surface Mount Package APPLICATION
● PWM applications
● Load switch
● Power management PINOUT D 技 k G XXXX 科 Te S Schematic diagram Marking and pin Assignment SOT-23 top view 特 ce ORDERING INFORMATION r Part Number 源 u MX2301 StorageTemperature -55°C to 150°C Package SOT-23 Devices Per Reel 3000 o
ABSOLUTE MAXIMUM RATINGS
(TA=25°C unless otherwise noted) 矽 S Parameter p Drain-Source Voltage i Gate-Source Voltage h Drain Current-Continuous C-PPuulslseeddDdrbain Current(Note1) Symbol VDS VGS ID IDM Limit -20 ±12 -3 -10 Unit V V A A Maximum Power Dissipation PD 1 W Operating Junction and Storage Temperature Range TJ, TSTG -55 to 150 °C THERMAL RESISTANCE Thermal Resistance, Junction-to-Ambient(Note2) RθJA 125 Note 1. Repetitive Rating: Pulse width limited by maximum junction temperature.
