FDZ2552P Description
bining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ2552P minimizes both PCB space and RDS(ON). This dual BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).
FDZ2552P Key Features
- = -6 A, -20 V. RDS(ON) = 0.045 Ω @ VGS = -4.5 V RDS(ON) = 0.075 Ω @ VGS = -2.5 V
- = Occupies only 0.10 cm2 of PCB area. 1/3 the area of SO-8. -= Ultra-thin package: less than 0.70 mm height when mounted
FDZ2552P Applications
- = Battery management -= Load switch -= Battery protection