| Part number | LP6836 |
|---|---|
| Datasheet | LP6836_FiltronicCompoundSemiconductors.pdf |
| File Size | 35.54 KB |
| Manufacturer | Filtronic Compound Semiconductors |
| Description | MEDIUM POWER PHEMT |
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AND APPLICATIONS DIE SIZE: 14.2X13.0 mils (360x330 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS:.
See all Filtronic Compound Semiconductors datasheets
| Part Number | Description |
|---|---|
| LP6836P100 | Packaged 0.25W Power PHEMT |
| LP6836P70 | PACKAGED MEDIUM POWER PHEMT |
| LP6836SOT343 | PACKAGED MEDIUM POWER PHEMT |
| LP6872 | 0.5W POWER PHEMT |
| LP6872P100 | Packaged 0.5W Power PHEMT |
