LP6836 Overview
AND APPLICATIONS DIE SIZE: 14.2X13.0 mils (360x330 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS:.
LP6836 Key Features
- 25 dBm Output Power at 1-dB pression at 18 GHz
- 9.5 dB Power Gain at 18 GHz
- 55% Power-Added Efficiency
- DESCRIPTION AND