LP6872 Overview
AND APPLICATIONS DIE SIZE: 14.6X19.7 mils (370x500 µm) DIE THICKNESS: 3.0 mils (75 µm) BONDING PADS:.
LP6872 Key Features
- 27 dBm Output Power at 1-dB pression at 18 GHz
- 9.5 dB Power Gain at 18 GHz
- 55% Power-Added Efficiency
- DESCRIPTION AND