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FPD10000V - 10W POWER PHEMT FOR WIMAX POWER AMPLIFIERS

General Description

AND APPLICATIONS DIE SIZE (µm): 3750 x 750 DIE THICKNESS: 50µm BONDING PADS (µm): >70 x 60 SEE BONDING DIAGRAM BELOW

The FPD10000V is a discrete depletion mode AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT), optimized for WiMAX (WMAN) IEEE 802.16 power amplifiers.

Key Features

  • Source thru-vias. 16 bonds each side, Gate and Drain. ¾ User must ensure that the die attach material is uniform and free of voiding underneath the die to ensure proper thermal heatsinking. A useful guideline is a 0.001.
  • 0.002 in. (0.025.
  • 0.050 mm) fillet of die attach material all around the periphery of the die.
  • All information and specifications are subject to change without notice. Phone: +1 408 850-5790 Fax: +1 408 850-5766 http:/www. filtronic. co. uk/semis Rev.

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Datasheet Details

Part number FPD10000V
Manufacturer Filtronic
File Size 244.64 KB
Description 10W POWER PHEMT FOR WIMAX POWER AMPLIFIERS
Datasheet download datasheet FPD10000V Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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PRELIMINARY • FPD10000V 10W POWER PHEMT FOR WIMAX POWER AMPLIFIERS PERFORMANCE (3.5 GHz) (802.16-2004 WiMAX Modulation) ♦ 30 dBm Output Power, < 2.5% EVM ♦ 9.5 dB Power Gain ♦ Class AB Efficiency 10% (10V / 1A IDQ) GATE DRAIN ♦ Class B Efficiency 18% (8V / 300 mA IDQ) BOND PAD BOND PAD ♦ 39 dBm CW Output Power (16X) (16X) ♦ > 48 dBm 3rd Order Intercept Point ♦ Plated Source Vias – No Source wirebonds needed ♦ 2.5 and 3.5 GHz Evaluation boards available (packaged device) DESCRIPTION AND APPLICATIONS DIE SIZE (µm): 3750 x 750 DIE THICKNESS: 50µm BONDING PADS (µm): >70 x 60 SEE BONDING DIAGRAM BELOW • The FPD10000V is a discrete depletion mode AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT), optimized for WiMAX (WMAN) IEEE 802.16 power amplifiers.