IXFB82N60Q3 Description
+150 A A A J V/ns W C C C Maximum Lead Temperature for Soldering 300 °C 1.6 mm (0.062in.) from Case for 10s 260 °C Mounting Force 30..120/6.7..27 N/lb. 10 g G D S Tab G = Gate D = Drain S = Source Tab = Drain.
IXFB82N60Q3 Key Features
- Low Intrinsic Gate Resistance
- Low Package Inductance
- Fast Intrinsic Rectifier
- Low R and Q
- High Power Density
- Easy to Mount
- Space Savings
- ID25, Note 1