IXFN30N110P Description
+150 300 2500 3000 1.5/13 1.3/11.5 30 V V V V A A A J V/ns W °C °C °C °C V~ V~ Nm/lb.in.
IXFN30N110P Key Features
- International standard package
- Encapsulating epoxy meets G = Gate S = Source D D = Drain S S G
- miniBLOC with Aluminium nitride
- Fast recovery diode
- Unclamped Inductive Switching (UIS)
- Low package inductance
- easy to drive and to protect Advantages
- Easy to mount
- Space savings
- High power density