• Part: IXFR24N50
  • Manufacturer: IXYS
  • Size: 66.84 KB
Download IXFR24N50 Datasheet PDF
IXFR24N50 page 2
Page 2

IXFR24N50 Description

Advanced Technical Information HiPerFETTM Power MOSFETs IXFR 26N50 ISOPLUS247TM IXFR 24N50 (Electrically Isolated Back Surface) N-Channel Enhancement Mode High dV/dt, Low trr, HDMOSTM Family .. +150 V V V V A A A A A A mJ V/ns ISOPLUS 247TM G D Isolated back surface G = Gate S = Source Patent pending D = Drain.

IXFR24N50 Key Features

  • Silicon chip on Direct-Copper-Bond substrate
  • High power dissipation
  • Isolated mounting surface
  • 2500V electrical isolation
  • Low drain to tab capacitance(<50pF)
  • Low RDS (on) HDMOSTM process
  • Rugged polysilicon gate cell structure
  • Unclamped Inductive Switching (UIS) rated
  • Fast intrinsic Rectifier