IXFR64N50Q3 Description
+150 C 300 °C 260 °C 2500 V Mounting Force 20..120/4.5..27 5 N/lb.
IXFR64N50Q3 Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface
- Low Intrinsic Gate Resistance
- 2500V~ Electrical Isolation
- Fast Intrinsic Rectifier
- Avalanche Rated
- Low Package Inductance
- High Power Density
- Easy to Mount
- Space Savings