SIGC08T60R3 Datasheet | Infineon

.. SIGC100T60R3 IGBT Chip Features : - 600V Trench & Field Stop technology - low VCE(sat) - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module Applications: - drives Chip Type SIGC100T60R3 VCE 600V ICn 200A Die Size 9.73 x 10.23 mm2 Package sawn on foil Ordering Code Q67050A4345-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Remended storage environment 9.73...