IRF6637PBF Overview
The IRF6637PbF bines the latest HEXFET® power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application...
IRF6637PBF Key Features
- Lead-Free (Qualified up to 260°C Reflow)
- Application Specific MOSFETs
- Ideal for CPU Core DC-DC Converters
- Low Conduction Losses and Switching Losses
- Low Profile (<0.7mm)
- Dual Sided Cooling patible
- patible with existing Surface Mount Techniques