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SI4435DY - Power MOSFET

Download the SI4435DY datasheet PDF. This datasheet also covers the SI4435DYPBF variant, as both devices belong to the same power mosfet family and are provided as variant models within a single manufacturer datasheet.

General Description

These P-channel HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area.

This benefit provides the designer with an extremely efficient device for use in battery and load management applications..

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (SI4435DYPBF_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
SI4435DY P-Channel MOSFET Kexin
SI4435DY 30V P-Channel MOSFET Fairchild Semiconductor
SI4435DY P-Channel MOSFET onsemi
Si4435DY 30V P-Channel MOSFET Vishay
SI4435DY -30V P-Channel MOSFET UMW

Other Datasheets by International Rectifier (now Infineon)

Part Number Description
SI4435DYPBF Power MOSFET
Si4410DY Power MOSFET
Si4410DYPbF Power MOSFET
Si4420DY Power MOSFET
Si4420DYPbF Power MOSFET

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
l Ultra Low On-Resistance l P-Channel MOSFET S l Surface Mount S l Available in Tape & Reel l Lead-Free S G Description These P-channel HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications.. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared, or wave soldering techniques.