IRF6724MPBF Description
The IRF6724MPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when...
IRF6724MPBF Key Features
- Dual Sided Cooling patible
- Ultra Low Package Inductance Qg tot Qgd Qgs2 Qrr Qoss Vgs(th)
- Ideal for CPU Core DC-DC Converters
- Optimized for Sync. FET socket of Sync. Buck Converter
- Low Conduction and Switching Losses
- patible with existing Surface Mount Techniques
- 100% Rg tested