K4H560838D-TCB3 Datasheet PDF - Samsung Semiconductor 256Mb D-die DDR Sdram Specs

K4H560838D-TCB3 - 256Mb D-die DDR Sdram

Datasheet Summary

Description

Clock : CK and CK are differential clock inputs.

All address and control input signals are sampled on the positive edge of CK and negative edge of CK.

Output (read) data is referenced to both edges of CK.

Features

Double-data-rate architecture; two data transfers per clock cycle.
Bidirectional data strobe(DQS).
Four banks operation.
Differential clock inputs(CK and CK).
DLL aligns DQ and DQS transition with CK transition.
MRS cycle with address key programs -. Read latency 2, 2.5 (clock) www. DataSheet4U. com -. Burst length (2, 4, 8) -. Burst type (sequential & interleave).
All inputs except data & DM are sampled at the positive going edge of.

Datasheet Details

Part number	K4H560838D-TCB3
Manufacturer	Samsung Semiconductor
File Size	205.14 KB
Description	256Mb D-die DDR Sdram
Datasheet	K4H560838D-TCB3 Datasheet
Additional preview pages of the K4H560838D-TCB3 datasheet.

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Full PDF Text Transcription

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256Mb Key Features • Double-data-rate architecture; two data transfers per clock cycle • Bidirectional data strobe(DQS) • Four banks operation • Differential clock inputs(CK and CK) • DLL aligns DQ and DQS transition with CK transition • MRS cycle with address key programs -. Read latency 2, 2.5 (clock) www.DataSheet4U.com -. Burst length (2, 4, 8) -. Burst type (sequential & interleave) • All inputs except data & DM are sampled at the positive going edge of the system clock(CK) • Data I/O transactions on both edges of data strobe • Edge aligned data output, center aligned data input • LDM,UDM/DM for write masking only • Auto & Self refresh • 7.8us refresh interval(8K/64ms refresh) • Maximum burst refresh cycle : 8 • 66pin TSOP II package DDR SDRAM ORDERING INFORMATION Part No.

Published: Aug 13, 2008 |