• Part: K4S1G0732B-TC75
  • Description: SDRAM stacked 1Gb B-die
  • Manufacturer: Samsung Semiconductor
  • Size: 126.67 KB
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Datasheet Summary

SDRAM stacked 1Gb B-die (x8) CMOS SDRAM stacked 1Gb B-die SDRAM Specification Revision 1.1 February 2004 - Samsung Electronics reserves the right to change products or specification without notice. Rev. 1.1 February 2004 SDRAM stacked 1Gb B-die (x8) Revision History Revision 1.0 (August, 2003) - First release. Revision 1.1 (February, 2004) -Corrected typo. CMOS SDRAM Rev. 1.1 February 2004 SDRAM stacked 1Gb B-die (x8) 32M x 8Bit x 4 Banks Synchronous DRAM Features - JEDEC standard 3.3V power supply - LVTTL patible with multiplexed address - Four banks operation - MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8) -. Burst type (Sequential &...